层流中加热电阻对温度分布影响的模拟 [英] Simulation of effect of heated resistance on temperature distribution in laminar flow
问题描述
我是Comsol的新手，我正在尝试模拟金属加热器电阻(金)对层流冷却水(水)的影响.由于金电阻的加热作用，我想获得流体中的静态温度分布.我可能缺少一些边界条件，因为我无法获得收敛的解.
I'm new to Comsol and I'm trying to simulate the effect of a metal heater resistance (gold) on a laminar cooling flow (water). I would like to get the stationary temperature distribution in the fluid due to the heating effect of the gold resistance. I'm probably missing some boundary condition since I cannot get my solution to converge.
到目前为止我所拥有的:
What I have so far:
- 二维轴对称几何 非等温流，这是层流和流体中的热传递之间的耦合.
- 入口边界条件(流速)
- 出口边界条件(压力)
- 流体温度初始条件:室温(298.15 K)
- 金抗性的边界温度条件(310 K)
- 用传热系数定义的对流热通量
- 2D axisymmetric geometry
- Non-Isothermal Flow, which is a coupling between a laminar flow and heat transfer in fluids.
- inlet boundary condition (flow rate)
- outlet boundary condition (pressure)
- fluid temperature initial condition : room temperature (298.15 K)
- boundary temperature condition for gold resistance (310 K)
- convective heat flux defined with heat transfer coefficient
我附上了模型构建器和几何图形的屏幕截图.有谁知道可能缺少哪些边界条件，或者为什么我的解决方案无法收敛?
I attached a screen-shot of the model builder and of my geometry. Does anyone know which boundary conditions may be missing or otherwise why my solution isn't converging?
谢谢！
推荐答案
假设您的热通量是恒定的或可定义的，那么您似乎具有正确的接口，但是我必须查看整个模型才能识别出问题.这里的信息不足.
It looks like you have the correct interfaces, assuming your heat flux is constant or definable, but I would have to look at your entire model in order to identify the problem. Not enough information here.
由于电阻加热，可以将其包含在另一个界面中.在这种情况下，您还必须包括圆柱壁的几何形状.这将取代您的热通量界面.
Since you have resistive heating, that can be included as another interface. In this case you would have to include the geometry of the cylindrical wall as well. This would replace your heat flux interface.
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